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Na C-Y, Jeon B-M, Kim J-W, Jung W-S, Jeong J-S, Cho S-M, Park H-S. Fabrication of 30 µm Sn Microbumps by Electroplating and Investigation of IMC Characteristics on Shear Strength. Electronics. 2023; 12(1):144. https://doi.org/10.3390/electronics12010144

Na, Chang-Yun, Byung-Min Jeon, Jong-Wook Kim, Woon-Seok Jung, Jae-Seong Jeong, Sung-Min Cho, and Hwa-Sun Park. 2023. "Fabrication of 30 µm Sn Microbumps by Electroplating and Investigation of IMC Characteristics on Shear Strength" Electronics 12, no. 1: 144. https://doi.org/10.3390/electronics12010144

Na, C.-Y., Jeon, B.-M., Kim, J.-W., Jung, W.-S., Jeong, J.-S., Cho, S.-M., & Park, H.-S. (2023). Fabrication of 30 µm Sn Microbumps by Electroplating and Investigation of IMC Characteristics on Shear Strength. Electronics, 12(1), 144. https://doi.org/10.3390/electronics12010144