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Journal: Electronics, 2022
Volume: 11
Number: 944

Article: Analysis of HBM Failure in 3D NAND Flash Memory
Authors: by Biruo Song, Zhiguo Li, Xin Wang, Xiang Fu, Fei Liu, Lei Jin and Zongliang Huo
Link: https://www.mdpi.com/2079-9292/11/6/944

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