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        Journal: Electronics, 2022
        Volume: 11 
                	Number: 944 
                
        
        Article:
        Analysis of HBM Failure in 3D NAND Flash Memory 
        Authors: 
       	by
                    Biruo Song, Zhiguo Li, Xin Wang, Xiang Fu, Fei Liu, Lei Jin and Zongliang Huo        
        Link:
        https://www.mdpi.com/2079-9292/11/6/944
        
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