Song, B.; Li, Z.; Wang, X.; Fu, X.; Liu, F.; Jin, L.; Huo, Z.
Analysis of HBM Failure in 3D NAND Flash Memory. Electronics 2022, 11, 944.
https://doi.org/10.3390/electronics11060944
AMA Style
Song B, Li Z, Wang X, Fu X, Liu F, Jin L, Huo Z.
Analysis of HBM Failure in 3D NAND Flash Memory. Electronics. 2022; 11(6):944.
https://doi.org/10.3390/electronics11060944
Chicago/Turabian Style
Song, Biruo, Zhiguo Li, Xin Wang, Xiang Fu, Fei Liu, Lei Jin, and Zongliang Huo.
2022. "Analysis of HBM Failure in 3D NAND Flash Memory" Electronics 11, no. 6: 944.
https://doi.org/10.3390/electronics11060944
APA Style
Song, B., Li, Z., Wang, X., Fu, X., Liu, F., Jin, L., & Huo, Z.
(2022). Analysis of HBM Failure in 3D NAND Flash Memory. Electronics, 11(6), 944.
https://doi.org/10.3390/electronics11060944