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Electronics
Volume 11
Issue 20
10.3390/electronics11203417
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Journal: Electronics, 2022
Volume: 11
Number: 3417

Article: Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper)
Authors: by Zhibo Zhao, Jinkai Li, Haoyun Yuan, Zeyu Wang, Giovanni Gugliandolo, Nicola Donato, Giovanni Crupi, Liming Si and Xiue Bao
Link: https://www.mdpi.com/2079-9292/11/20/3417

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

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