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Journal: ElectronicsVolume: 11Number: 3417
Article: Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper)
  • Authors:
  • Zhibo Zhao1,
  • Jinkai Li2 and
  • Haoyun Yuan1
  • et al.
Link: https://www.mdpi.com/2079-9292/11/20/3417

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