Zhao, Z.; Li, J.; Yuan, H.; Wang, Z.; Gugliandolo, G.; Donato, N.; Crupi, G.; Si, L.; Bao, X.
Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper). Electronics 2022, 11, 3417.
https://doi.org/10.3390/electronics11203417
AMA Style
Zhao Z, Li J, Yuan H, Wang Z, Gugliandolo G, Donato N, Crupi G, Si L, Bao X.
Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper). Electronics. 2022; 11(20):3417.
https://doi.org/10.3390/electronics11203417
Chicago/Turabian Style
Zhao, Zhibo, Jinkai Li, Haoyun Yuan, Zeyu Wang, Giovanni Gugliandolo, Nicola Donato, Giovanni Crupi, Liming Si, and Xiue Bao.
2022. "Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper)" Electronics 11, no. 20: 3417.
https://doi.org/10.3390/electronics11203417
APA Style
Zhao, Z., Li, J., Yuan, H., Wang, Z., Gugliandolo, G., Donato, N., Crupi, G., Si, L., & Bao, X.
(2022). Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper). Electronics, 11(20), 3417.
https://doi.org/10.3390/electronics11203417
