Su, C.-Y.; Huang, J.-L.; Chen, P.-C.; Yu, H.-J.; Ma, D.-L.; Yu, B.-Y.
A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers. Coatings 2018, 8, 401.
https://doi.org/10.3390/coatings8110401
AMA Style
Su C-Y, Huang J-L, Chen P-C, Yu H-J, Ma D-L, Yu B-Y.
A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers. Coatings. 2018; 8(11):401.
https://doi.org/10.3390/coatings8110401
Chicago/Turabian Style
Su, Cherng-Yuh, Jia-Liang Huang, Po-Chun Chen, Hsin-Jung Yu, Dai-Liang Ma, and Bang-Ying Yu.
2018. "A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers" Coatings 8, no. 11: 401.
https://doi.org/10.3390/coatings8110401
APA Style
Su, C.-Y., Huang, J.-L., Chen, P.-C., Yu, H.-J., Ma, D.-L., & Yu, B.-Y.
(2018). A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers. Coatings, 8(11), 401.
https://doi.org/10.3390/coatings8110401