The working temperature of electronic components directly determines their service life and stability. In order to ensure normal operation of electronic components, cooling the coating is one of the best ways to solve the problem. Based on an acrylic amino-resin system, a dissipating coating was prepared with carbon fiber (CF) as the main thermal conductive filler. The influence of the CF content on the thermal conductivity was determined by the single factor method. The surface structure was observed by scanning electron microscopy (SEM). The results show: With the increase of the CF mass fraction, both the heat dispersion and heat conduction coefficient of the coating tend to increase at first and then decrease, and the heat dissipation effect is optimum when the CF mass fraction is 12.3 wt %. At this point, the coating shows an excellent comprehensive performance, such as 1st level adhesion, H grade hardness, and thermal conductivity of 1.61 W/m·K. Furthermore, this paper explored the radiating mechanism of coating in which CF produces a coating which forms a heat “channel” for rapid heat conduction. When the optimal value is exceeded, the cooling effect is reduced because of the accumulation and the anisotropy of CF.
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