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Editorial

Coatings for Advanced Devices

School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, China
Coatings 2025, 15(2), 219; https://doi.org/10.3390/coatings15020219
Submission received: 8 February 2025 / Accepted: 11 February 2025 / Published: 12 February 2025
(This article belongs to the Special Issue Coatings for Advanced Devices)
The continuous evolution of coating materials is critically important to driving innovative technologies in various domains, especially advanced electrical devices. This is because most current devices and systems operate under ever-complicated and harsh conditions, which makes the demand for coatings with enhanced mechanical, thermal, and functional properties increasingly high. Recent research has focused on the development of new coating compositions, advanced deposition techniques, and innovative material designs to improve interfacial adhesion and mitigate thermal stresses, enhance corrosion resistance, and optimize optical performance.
This Special Issue combines 10 papers and brings together a collection of studies that address critical challenges in innovative research and applications based on coating technologies, ranging from electronic packaging and high-temperature environments to sustainable polymer coatings and optical protection. Leading scientists and engineers discuss the challenges and breakthroughs that arise within coating technologies that emphasize how high-end coating technologies shape the next generation of high-performance electronic devices. The contributions put together related knowledge from the areas of computational modeling and experimental characterization that outline the constantly evolving landscape of coating materials for their potential in enabling next-generation technologies and defining the future of the development of sophisticated devices, attaining unprecedented levels of reliability, efficiency, and versatility. We invite the reader to learn about the transformative effect of pioneering thin film/substrate systems in advanced devices that are pushing the boundaries of electronics, energy, and beyond, ushering in an era wherein technology and sustainability will thrive in harmony.
Long et al. [1] proposed a method for determining the elastoplastic properties of thin films by indentation using a dimensionless analysis. This is a key tool in material characterization for electronic packaging and other microelectronics applications. The investigation by Su et al. [2] extended this understanding by proposing fiber-reinforced composites that can be used to tune the CTE for multilayered coatings—an effective mitigation approach against thermal stresses in thin-film systems. Going beyond the mechanical properties of coatings, Wang et al. [3] studied the viscoelastic behavior of memory chip 3D-stacked packaging, using finite element simulations to predict the effects of epoxy molding compound materials on electronic packaging reliability. In the realm of semiconductor packaging in harsh service conditions, Yoo and Kim [4] explored the galvanic corrosion behavior of Cu-based wire bonding, providing valuable insights into enhancing the longevity of electronic components exposed to corrosive environments. Coatings have also contributed much to the energy sector, where Drinčić et al. [5] analyzed the degradation processes of solar absorber coatings; for parabolic trough collectors, they suggested durable materials. Similarly, Yang et al. [6] studied NiO-doped Ga2O3 thin films, which have opened new prospects for enhancing performance in wide-bandgap semiconductors for energy-related devices.
Further extending the method of investigation and service scenarios of the coating materials and technologies, Zhao et al. [7] made a first-principles calculation of the mechanical properties of Ni3Sn4-based intermetallic compounds with cerium doping to highlight their potential for application in soldering in microelectronics. They also explored the microstructure and mechanical properties of TixNbMoTaW refractory high-entropy alloys, offering a novel approach to the development of robust coatings for extreme temperature environments, such as those encountered in high-performance aerospace and automotive applications [8]. Zou et al. [9] presented an innovative toughened bamboo-fiber-modified epoxy resin coating, which demonstrates superior interfacial compatibility, making it a promising candidate for bio-based, environmentally friendly polymer coatings. Eversole et al. [10] studied optical limiting in CdSe-based multiphase polymer nanocomposite films, further extending the role of coatings in optical applications by offering enhanced protection capabilities for optoelectronic devices under intense illumination.
Last but not least, this Special Issue is focused on coatings for enhancing performance, reliability, and sustainability in electronic devices in various domains. Papers in this Special Issue provide insights into different technologies and applications that will be shaping the functionality of advanced devices and systems in the future.

Conflicts of Interest

The author declares no conflicts of interest.

References

  1. Long, X.; Li, J.; Shen, Z.; Su, Y. Dimensionless Analysis to Determine Elastoplastic Properties of Thin Films by Indentation. Coatings 2022, 12, 1768. [Google Scholar] [CrossRef]
  2. Long, X.; Su, T.; Chen, Z.; Su, Y.; Siow, K.S. Tunable Coefficient of Thermal Expansion of Composite Materials for Thin-Film Coatings. Coatings 2022, 12, 836. [Google Scholar] [CrossRef]
  3. Wang, X.; Cao, S.; Lu, G.; Yang, D. Viscoelastic Simulation of Stress and Warpage for Memory Chip 3D-Stacked Package. Coatings 2022, 12, 1976. [Google Scholar] [CrossRef]
  4. Yoo, Y.R.; Kim, Y.S. Effects of Pd Alloying and Coating on the Galvanic Corrosion between Cu Wire and Bond Pads for a Semiconductor Packaging. Coatings 2024, 14, 544. [Google Scholar] [CrossRef]
  5. Drinčić, A.; Noč, L.; Merzel, F.; Jerman, I. Future Parabolic Trough Collector Absorber Coating Development and Service Lifetime Estimation. Coatings 2024, 14, 1111. [Google Scholar] [CrossRef]
  6. Yang, C.F.; Tsao, E.C.; Wang, Y.W.; Lin, H.P.; Meen, T.H.; Liao, S.H. Analyses of the Properties of the NiO-Doped Ga2O3 Wide-Bandgap Semiconductor Thin Films. Coatings 2024, 14, 1615. [Google Scholar] [CrossRef]
  7. Zhao, R.; Cao, Y.; He, J.; Chen, J.; Liu, S.; Yang, Z.; Lin, J.; Chang, C. First-Principles Study on the Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds with Ce Doping. Coatings 2025, 15, 59. [Google Scholar] [CrossRef]
  8. Zhao, R.; Cao, Y.; He, J.; Chen, J.; Liu, S.; Yang, Z.; Lin, J.; Chang, C. Microstructure and Mechanical Properties of TixNbMoTaW Refractory High-Entropy Alloy for Bolt Coating Applications. Coatings 2025, 15, 120. [Google Scholar] [CrossRef]
  9. Zou, B.; Huang, K.; Ma, J. Toughened Bamboo-Fiber-Modified Epoxy Resin: A Novel Polymer Coating for Superior Interfacial Compatibility. Coatings 2025, 15, 181. [Google Scholar] [CrossRef]
  10. Eversole, L.M.; Adjorlolo, R.; Renaud, J.F.; Bhowmick, M. Optical Limiting from CdSe-Based Multiphase Polymer Nanocomposite Films. Coatings 2024, 14, 634. [Google Scholar] [CrossRef]
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MDPI and ACS Style

Long, X. Coatings for Advanced Devices. Coatings 2025, 15, 219. https://doi.org/10.3390/coatings15020219

AMA Style

Long X. Coatings for Advanced Devices. Coatings. 2025; 15(2):219. https://doi.org/10.3390/coatings15020219

Chicago/Turabian Style

Long, Xu. 2025. "Coatings for Advanced Devices" Coatings 15, no. 2: 219. https://doi.org/10.3390/coatings15020219

APA Style

Long, X. (2025). Coatings for Advanced Devices. Coatings, 15(2), 219. https://doi.org/10.3390/coatings15020219

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