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Journal: Coatings, 2022
Volume: 12
Number: 995
995
Article: Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating
Authors: by Wen Ge, Wensheng Li, Rihong Li, Yifan Dong, Ziming Zeng, Hui Cao, Longlin Yu, Zhijie Wen and Jin He
Link: https://www.mdpi.com/2079-6412/12/7/995

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