Ge, W.; Li, W.; Li, R.; Dong, Y.; Zeng, Z.; Cao, H.; Yu, L.; Wen, Z.; He, J.
Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating. Coatings 2022, 12, 995.
https://doi.org/10.3390/coatings12070995
AMA Style
Ge W, Li W, Li R, Dong Y, Zeng Z, Cao H, Yu L, Wen Z, He J.
Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating. Coatings. 2022; 12(7):995.
https://doi.org/10.3390/coatings12070995
Chicago/Turabian Style
Ge, Wen, Wensheng Li, Rihong Li, Yifan Dong, Ziming Zeng, Hui Cao, Longlin Yu, Zhijie Wen, and Jin He.
2022. "Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating" Coatings 12, no. 7: 995.
https://doi.org/10.3390/coatings12070995
APA Style
Ge, W., Li, W., Li, R., Dong, Y., Zeng, Z., Cao, H., Yu, L., Wen, Z., & He, J.
(2022). Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating. Coatings, 12(7), 995.
https://doi.org/10.3390/coatings12070995