Tranvouez, N.; Steyer, P.; Malchère, A.; Boulet, P.; Capon, F.; Bauer, J.-P.; Pierson, J.-F.
Effect of Thermal Stresses Formed during Air Annealing of Amorphous Lanthanum Cuprate Thin Films Deposited on Silicon Substrate. Coatings 2020, 10, 613.
https://doi.org/10.3390/coatings10070613
AMA Style
Tranvouez N, Steyer P, Malchère A, Boulet P, Capon F, Bauer J-P, Pierson J-F.
Effect of Thermal Stresses Formed during Air Annealing of Amorphous Lanthanum Cuprate Thin Films Deposited on Silicon Substrate. Coatings. 2020; 10(7):613.
https://doi.org/10.3390/coatings10070613
Chicago/Turabian Style
Tranvouez, Nolwenn, Philippe Steyer, Annie Malchère, Pascal Boulet, Fabien Capon, Jean-Philippe Bauer, and Jean-François Pierson.
2020. "Effect of Thermal Stresses Formed during Air Annealing of Amorphous Lanthanum Cuprate Thin Films Deposited on Silicon Substrate" Coatings 10, no. 7: 613.
https://doi.org/10.3390/coatings10070613
APA Style
Tranvouez, N., Steyer, P., Malchère, A., Boulet, P., Capon, F., Bauer, J.-P., & Pierson, J.-F.
(2020). Effect of Thermal Stresses Formed during Air Annealing of Amorphous Lanthanum Cuprate Thin Films Deposited on Silicon Substrate. Coatings, 10(7), 613.
https://doi.org/10.3390/coatings10070613