Wei, L.; He, Y.; Lv, Z.; Guo, D.; Cheng, L.; Wu, H.; Liu, A.
Full-Cut Manufacture of Skin-Interfaced Microfluidic Patch with Copper Electrode for In Situ Admittance Sensing of Sweat Rate. Biosensors 2023, 13, 67.
https://doi.org/10.3390/bios13010067
AMA Style
Wei L, He Y, Lv Z, Guo D, Cheng L, Wu H, Liu A.
Full-Cut Manufacture of Skin-Interfaced Microfluidic Patch with Copper Electrode for In Situ Admittance Sensing of Sweat Rate. Biosensors. 2023; 13(1):67.
https://doi.org/10.3390/bios13010067
Chicago/Turabian Style
Wei, Lei, Yuxin He, Zihan Lv, Daoyou Guo, Lin Cheng, Huaping Wu, and Aiping Liu.
2023. "Full-Cut Manufacture of Skin-Interfaced Microfluidic Patch with Copper Electrode for In Situ Admittance Sensing of Sweat Rate" Biosensors 13, no. 1: 67.
https://doi.org/10.3390/bios13010067
APA Style
Wei, L., He, Y., Lv, Z., Guo, D., Cheng, L., Wu, H., & Liu, A.
(2023). Full-Cut Manufacture of Skin-Interfaced Microfluidic Patch with Copper Electrode for In Situ Admittance Sensing of Sweat Rate. Biosensors, 13(1), 67.
https://doi.org/10.3390/bios13010067