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Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects

Department of Chemical Engineering, Kyoto University, Kyoto 615-8510, Japan
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Nanomaterials 2019, 9(12), 1742; https://doi.org/10.3390/nano9121742
Received: 2 November 2019 / Revised: 28 November 2019 / Accepted: 5 December 2019 / Published: 6 December 2019
(This article belongs to the Special Issue Nanostructured Materials for Solar Cell Applications)
A new concept of semiconductor wafer bonding, mediated by optical wavelength conversion materials, is proposed and demonstrated. The fabrication scheme provides simultaneous bond formation and interfacial function generation, leading to efficient device production. Wavelength-converting functionalized semiconductor interfacial engineering is realized by utilizing an adhesive viscous organic matrix with embedded fluorescent particles. The bonding is carried out in ambient air at room temperature and therefore provides a cost advantage with regard to device manufacturing. Distinct wavelength conversion, from ultraviolet into visible, and high mechanical stabilities and electrical conductivities in the bonded interfaces are verified, demonstrating their versatility for practical applications. This bonding and interfacial scheme can improve the performance and structural flexibility of optoelectronic devices, such as solar cells, by allowing the spectral light incidence suitable for each photovoltaic material, and photonic integrated circuits, by delivering the respective preferred frequencies to the optical amplifier, modulator, waveguide, and detector materials. View Full-Text
Keywords: semiconductor; interface; wafer bonding; frequency conversion; optoelectronics; photonic device; solar cell; photonic integrated circuit semiconductor; interface; wafer bonding; frequency conversion; optoelectronics; photonic device; solar cell; photonic integrated circuit
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MDPI and ACS Style

Kishibe, K.; Hirata, S.; Inoue, R.; Yamashita, T.; Tanabe, K. Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects. Nanomaterials 2019, 9, 1742.

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