Li, Y.; Zhou, H.; Wu, C.; Yin, Z.; Liu, C.; Liu, J.; Shi, Z.
Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique. Nanomaterials 2023, 13, 878.
https://doi.org/10.3390/nano13050878
AMA Style
Li Y, Zhou H, Wu C, Yin Z, Liu C, Liu J, Shi Z.
Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique. Nanomaterials. 2023; 13(5):878.
https://doi.org/10.3390/nano13050878
Chicago/Turabian Style
Li, Yaqiang, Hongyu Zhou, Chunjing Wu, Zheng Yin, Chang Liu, Junyou Liu, and Zhongliang Shi.
2023. "Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique" Nanomaterials 13, no. 5: 878.
https://doi.org/10.3390/nano13050878
APA Style
Li, Y., Zhou, H., Wu, C., Yin, Z., Liu, C., Liu, J., & Shi, Z.
(2023). Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique. Nanomaterials, 13(5), 878.
https://doi.org/10.3390/nano13050878