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Journal: Nanomaterials, 2023
Volume: 13
Number: 2490

Article: Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
Authors: by Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung and Kuan-Neng Chen
Link: https://www.mdpi.com/2079-4991/13/17/2490

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