Huang, Y.-C.; Lin, Y.-X.; Hsiung, C.-K.; Hung, T.-H.; Chen, K.-N.
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application. Nanomaterials 2023, 13, 2490.
https://doi.org/10.3390/nano13172490
AMA Style
Huang Y-C, Lin Y-X, Hsiung C-K, Hung T-H, Chen K-N.
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application. Nanomaterials. 2023; 13(17):2490.
https://doi.org/10.3390/nano13172490
Chicago/Turabian Style
Huang, Yuan-Chiu, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, and Kuan-Neng Chen.
2023. "Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application" Nanomaterials 13, no. 17: 2490.
https://doi.org/10.3390/nano13172490
APA Style
Huang, Y.-C., Lin, Y.-X., Hsiung, C.-K., Hung, T.-H., & Chen, K.-N.
(2023). Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application. Nanomaterials, 13(17), 2490.
https://doi.org/10.3390/nano13172490