Hsu, W.-L.; Chen, Y.-C.; Yeh, S.P.; Zeng, Q.-C.; Huang, Y.-W.; Wang, C.-M.
Review of Metasurfaces and Metadevices: Advantages of Different Materials and Fabrications. Nanomaterials 2022, 12, 1973.
https://doi.org/10.3390/nano12121973
AMA Style
Hsu W-L, Chen Y-C, Yeh SP, Zeng Q-C, Huang Y-W, Wang C-M.
Review of Metasurfaces and Metadevices: Advantages of Different Materials and Fabrications. Nanomaterials. 2022; 12(12):1973.
https://doi.org/10.3390/nano12121973
Chicago/Turabian Style
Hsu, Wei-Lun, Yen-Chun Chen, Shang Ping Yeh, Qiu-Chun Zeng, Yao-Wei Huang, and Chih-Ming Wang.
2022. "Review of Metasurfaces and Metadevices: Advantages of Different Materials and Fabrications" Nanomaterials 12, no. 12: 1973.
https://doi.org/10.3390/nano12121973
APA Style
Hsu, W.-L., Chen, Y.-C., Yeh, S. P., Zeng, Q.-C., Huang, Y.-W., & Wang, C.-M.
(2022). Review of Metasurfaces and Metadevices: Advantages of Different Materials and Fabrications. Nanomaterials, 12(12), 1973.
https://doi.org/10.3390/nano12121973