Next Article in Journal
Anisotropic Photonics Topological Transition in Hyperbolic Metamaterials Based on Black Phosphorus
Previous Article in Journal
Antimicrobial and Biocompatible Polycaprolactone and Copper Oxide Nanoparticle Wound Dressings against Methicillin-Resistant Staphylococcus aureus
Article

Molecular Dynamics Simulation on Creep Behavior of Nanocrystalline TiAl Alloy

by 1,2, 3, 4,*, 5, 3 and 2,3,*
1
National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing 100083, China
2
Key Laboratory of Fluid Interaction with Material, Ministry of Education, Beijing 100083, China
3
School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China
4
China Nuclear Power Technology Research Institute Co., Ltd., Reactor Engineering and Safety Research Center, Shenzhen 518031, China
5
Beijing Advanced Innovation Center of Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
*
Authors to whom correspondence should be addressed.
Nanomaterials 2020, 10(9), 1693; https://doi.org/10.3390/nano10091693
Received: 12 August 2020 / Revised: 24 August 2020 / Accepted: 25 August 2020 / Published: 28 August 2020
TiAl alloy represents a new class of light and heat-resistant materials. In this study, the effect of temperature, pressure, and grain size on the high-temperature creep properties of nanocrystalline TiAl alloy have been studied through the molecular dynamics method. Based on this, the deformation mechanism of the different creep stages, including crystal structure, dislocation, and diffusion, has been explored. It is observed that the high-temperature creep performance of nanocrystalline TiAl alloy is significantly affected by temperature and stress. The higher is the temperature and stress, the greater the TiAl alloy’s steady-state creep rate and the faster the rapid creep stage. Smaller grain size accelerates the creep process due to the large volume fraction of the grain boundary. In the steady-state deformation stage, two kinds of creep mechanisms are manly noted, i.e., dislocation motion and grain boundary diffusion. At the same temperature, the creep mechanism is dominated by the dislocation motion in a high-stress field, and the creep mechanism is dominated by the diffusion creep in the low-stress field. However, it is observed to be mainly controlled by the grain boundary diffusion and lattice diffusion in the rapid creep stage. View Full-Text
Keywords: molecular dynamics simulation; creep behavior; nanocrystalline; TiAl alloy molecular dynamics simulation; creep behavior; nanocrystalline; TiAl alloy
Show Figures

Figure 1

MDPI and ACS Style

Zhao, F.; Zhang, J.; He, C.; Zhang, Y.; Gao, X.; Xie, L. Molecular Dynamics Simulation on Creep Behavior of Nanocrystalline TiAl Alloy. Nanomaterials 2020, 10, 1693. https://doi.org/10.3390/nano10091693

AMA Style

Zhao F, Zhang J, He C, Zhang Y, Gao X, Xie L. Molecular Dynamics Simulation on Creep Behavior of Nanocrystalline TiAl Alloy. Nanomaterials. 2020; 10(9):1693. https://doi.org/10.3390/nano10091693

Chicago/Turabian Style

Zhao, Fei, Jie Zhang, Chenwei He, Yong Zhang, Xiaolei Gao, and Lu Xie. 2020. "Molecular Dynamics Simulation on Creep Behavior of Nanocrystalline TiAl Alloy" Nanomaterials 10, no. 9: 1693. https://doi.org/10.3390/nano10091693

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop