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Integrating Emotional Attachment and Sustainability in Electronic Product Design
Department of Industrial Design, Rochester Institute of Technology, 73 Lomb Memorial Drive, Rochester, NY 14623, USA
Golisano Institute for Sustainability, Rochester Institute of Technology, 81-2173, 111 Lomb Memorial Dr., Rochester, NY 14623, USA
* Author to whom correspondence should be addressed.
Received: 5 February 2013; in revised form: 24 February 2013 / Accepted: 4 March 2013 / Published: 14 March 2013
Abstract: Current models for Information and Communication Technology (ICT) products encourage frequent product replacement with newer versions that offer only minor incremental improvements. This pattern, named planned obsolescence, diminishes user experience and shortens product lifespan. This paper presents the conceptual basis for a two-part integrated approach to combating planned obsolescence in ICT devices. First, design for emotional attachment, which creates products that users enjoy, value, and use for longer. Second, technological adaptability, which anticipates product upgrades and repairs as new technologies emerge. A model interdisciplinary design course in industrial design and sustainability, also described herein, trains students to apply this approach to create innovative ICT products with smaller environmental footprints.
Keywords: sustainability; industrial design; emotional attachment; design education
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MDPI and ACS Style
Lobos, A.; Babbitt, C.W. Integrating Emotional Attachment and Sustainability in Electronic Product Design. Challenges 2013, 4, 19-33.
Lobos A, Babbitt CW. Integrating Emotional Attachment and Sustainability in Electronic Product Design. Challenges. 2013; 4(1):19-33.
Lobos, Alex; Babbitt, Callie W. 2013. "Integrating Emotional Attachment and Sustainability in Electronic Product Design." Challenges 4, no. 1: 19-33.