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Journal: Appl. Sci., 2019
Volume: 9
Number: 1556

Article: Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints
Authors: by Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano and Akio Hirose
Link: https://www.mdpi.com/2076-3417/9/8/1556

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