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Journal: Appl. Sci., 2019
Volume: 9
Number: 2623

Article: Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process
Authors: by Chun-Ming Yang, Kuo-Ping Lin and Kuen-Suan Chen
Link: https://www.mdpi.com/2076-3417/9/13/2623

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