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Journal: Appl. Sci., 2019
Volume: 9
Number: 2623
Article:
Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process
Authors:
by
Chun-Ming Yang, Kuo-Ping Lin and Kuen-Suan Chen
Link:
https://www.mdpi.com/2076-3417/9/13/2623
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