Numerical Simulation and Experimental Validation for the Thermal Analysis of a Compact LED Recessed Downlight with Heat Sink Design
Abstract
:1. Introduction
2. Problem Formulation
2.1. Theoretical Background
2.2. Numerical Simulation Modeling
2.3. Experimental Fabrication
3. Results and Discussion
3.1. Numerical Simulations Results
3.2. Experimental Results
4. Conclusions
Acknowledgments
Author Contributions
Conflicts of Interest
Nomenclature
T | Temperature |
Tj | Junction temperature |
Tsp | Solder point temperature |
Tb | MCPCB temperature |
MCPCB | Metal core printed circuit board |
Th | Aluminum housing temperature |
Ths | Heat sink temperature |
Tbox | Test box temperature |
Tref | Reference point temperature |
Troom | Room atmosphere temperature (25 °C) |
Rth | Thermal resistance |
Rth, j-sp | Thermal resistance between junction and solder point |
Rth, sp-b | Thermal resistance between solder point and MCPCB |
Rth, b-h | Thermal resistance between MCPCB and aluminum housing |
Rth, h-hs | Thermal resistance between aluminum housing and heat sink |
Rth, hs-box | Thermal resistance between heat sink and test box |
Rth, h-ref | Thermal resistance between aluminum housing and reference point |
Rth, sp-ref | Thermal resistance between solder point and reference point |
A.F. | Acceleration Factor is the test time multiplier derived from the Arrhenius equation. |
Ea | Acceleration energy in electron-volts (eV), thermal activation energy 0.5–0.7eV for assembly defects |
kb | Boltzmann’s constant (kb = 8.617 × 10−5 eV/K) |
K | Temperature Kelvin |
Tuse | Temperature in normal use, in degrees Kelvin (K = °C + 273) |
Ttest | Temperature in testing, in degrees Kelvin |
e | Natural logarithms (2.71828) |
μ | Dynamic viscosity of air |
u | The velocity vector |
ρ | Density of air |
I | The identity matrix |
p | The pressure |
k | The thermal conductivity |
Cp | The specific heat capacity |
F | The volume force (body force) in any point of the fluid |
εp | The porosity of the porous material |
κ | The permeability tensor of the porous media |
Qbr | A mass source or mass sink, accounts for mass deposit and mass creation within the domains |
β | The volumetric thermal expansion coefficient of the fluid. |
T0 | The room atmosphere temperature at 25 °C |
Ptotal | Total power (W) input to LED (If × Vf, If is LED forward current, Vf is forward Voltage) |
Superscript | |
T | The transpose matrix |
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Case | Heat sink | Height (mm) | Before | After | ||||
---|---|---|---|---|---|---|---|---|
Tsp (°C) | Temperature Difference (°C) | Tsp (°C) | Temperature Difference (°C) | |||||
1 | ALFHS | 17 | 87.0 | Higher | 0.4 | 100.1 | Higher | 8.4 |
CUFHS | 17 | 86.6 | 91.7 | |||||
2 | ALFHS | 20 | 85.0 | 94.5 | Higher | 2.8 | ||
CUFHS | 17 | 86.6 | Higher | 1.6 | 91.7 | |||
3 | ALFHS | 23 | 83.4 | 91.7 | Same | 0.0 | ||
CUFHS | 17 | 86.6 | Higher | 3.2 | 91.7 |
Time (min.) | TSP | Tj | Tref | T1 | T2 | T3 | T4 | T5 |
---|---|---|---|---|---|---|---|---|
120 | 91.7 | 121.7 | 83.6 | 65.1 | 48.5 | 37.8 | 39.1 | 71.7 |
Time (min) | Tsp | Tj | Tref | T1 | T2 | T3 | T4 | T5 |
---|---|---|---|---|---|---|---|---|
120 | 91.7 | 121.7 | 81.4 | 56.1 | 47.4 | 40.2 | 38.1 | 62.1 |
© 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
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Hsu, H.-C.; Huang, Y.-C. Numerical Simulation and Experimental Validation for the Thermal Analysis of a Compact LED Recessed Downlight with Heat Sink Design. Appl. Sci. 2017, 7, 4. https://doi.org/10.3390/app7010004
Hsu H-C, Huang Y-C. Numerical Simulation and Experimental Validation for the Thermal Analysis of a Compact LED Recessed Downlight with Heat Sink Design. Applied Sciences. 2017; 7(1):4. https://doi.org/10.3390/app7010004
Chicago/Turabian StyleHsu, Huan-Chu, and Yi-Cheng Huang. 2017. "Numerical Simulation and Experimental Validation for the Thermal Analysis of a Compact LED Recessed Downlight with Heat Sink Design" Applied Sciences 7, no. 1: 4. https://doi.org/10.3390/app7010004
APA StyleHsu, H.-C., & Huang, Y.-C. (2017). Numerical Simulation and Experimental Validation for the Thermal Analysis of a Compact LED Recessed Downlight with Heat Sink Design. Applied Sciences, 7(1), 4. https://doi.org/10.3390/app7010004