El Yassi, M.; Pierre, A.; Danché, V.; Darcherif, I.; Mélinge, Y.
Three-Dimensionally Printed Gypsum Located Within Micro-Encapsulated Phase Change Material: Thermal Conductivity Benefits of Selective Activation Technique. Appl. Sci. 2025, 15, 1929.
https://doi.org/10.3390/app15041929
AMA Style
El Yassi M, Pierre A, Danché V, Darcherif I, Mélinge Y.
Three-Dimensionally Printed Gypsum Located Within Micro-Encapsulated Phase Change Material: Thermal Conductivity Benefits of Selective Activation Technique. Applied Sciences. 2025; 15(4):1929.
https://doi.org/10.3390/app15041929
Chicago/Turabian Style
El Yassi, Marwa, Alexandre Pierre, Valentine Danché, Ikram Darcherif, and Yannick Mélinge.
2025. "Three-Dimensionally Printed Gypsum Located Within Micro-Encapsulated Phase Change Material: Thermal Conductivity Benefits of Selective Activation Technique" Applied Sciences 15, no. 4: 1929.
https://doi.org/10.3390/app15041929
APA Style
El Yassi, M., Pierre, A., Danché, V., Darcherif, I., & Mélinge, Y.
(2025). Three-Dimensionally Printed Gypsum Located Within Micro-Encapsulated Phase Change Material: Thermal Conductivity Benefits of Selective Activation Technique. Applied Sciences, 15(4), 1929.
https://doi.org/10.3390/app15041929