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Journal: Appl. Sci., 2025
Volume: 15
Number: 466

Article: Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution
Authors: by Uğur Köklü, Abdullah Sadık Tazegül, Fatih Serin and Gültekin Basmacı
Link: https://www.mdpi.com/2076-3417/15/1/466

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