Köklü, U.; Tazegül, A.S.; Serin, F.; Basmacı, G.
Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. Appl. Sci. 2025, 15, 466.
https://doi.org/10.3390/app15010466
AMA Style
Köklü U, Tazegül AS, Serin F, Basmacı G.
Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. Applied Sciences. 2025; 15(1):466.
https://doi.org/10.3390/app15010466
Chicago/Turabian Style
Köklü, Uğur, Abdullah Sadık Tazegül, Fatih Serin, and Gültekin Basmacı.
2025. "Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution" Applied Sciences 15, no. 1: 466.
https://doi.org/10.3390/app15010466
APA Style
Köklü, U., Tazegül, A. S., Serin, F., & Basmacı, G.
(2025). Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. Applied Sciences, 15(1), 466.
https://doi.org/10.3390/app15010466