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Journal: Appl. Sci., 2024
Volume: 14
Number: 9780

Article: Electroless Copper Patterning on TiO2-Functionalized Mica for Flexible Electronics
Authors: by Bozhidar I. Stefanov, Boriana R. Tzaneva, Valentin M. Mateev and Ivo T. Iliev
Link: https://www.mdpi.com/2076-3417/14/21/9780

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