Wei, K.; Shi, P.; Bao, P.; Gao, X.; Du, Y.; Qin, Y.
Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices. Appl. Sci. 2023, 13, 5209.
https://doi.org/10.3390/app13085209
AMA Style
Wei K, Shi P, Bao P, Gao X, Du Y, Qin Y.
Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices. Applied Sciences. 2023; 13(8):5209.
https://doi.org/10.3390/app13085209
Chicago/Turabian Style
Wei, Kaixin, Peiji Shi, Pili Bao, Xianping Gao, Yang Du, and Yanzhou Qin.
2023. "Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices" Applied Sciences 13, no. 8: 5209.
https://doi.org/10.3390/app13085209
APA Style
Wei, K., Shi, P., Bao, P., Gao, X., Du, Y., & Qin, Y.
(2023). Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices. Applied Sciences, 13(8), 5209.
https://doi.org/10.3390/app13085209
