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Journal: Appl. Sci., 2023
Volume: 13
Number: 2737

Article: Thermomechanical Stresses in Silicon Chips for Optoelectronic Devices
Authors: by Claudia Mezzalira, Fosca Conti, Danilo Pedron and Raffaella Signorini
Link: https://www.mdpi.com/2076-3417/13/4/2737

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