Next Article in Journal
A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis
Next Article in Special Issue
Hash Based DNA Computing Algorithm for Image Encryption
Previous Article in Journal
Biothermal Heating on Human Skin by Millimeter and Sub-Terahertz Waves in Outdoor Environment—A Theoretical Study
Previous Article in Special Issue
Faster RCNN Target Detection Algorithm Integrating CBAM and FPN
 
 
Article

Article Versions Notes

Appl. Sci. 2023, 13(14), 8307; https://doi.org/10.3390/app13148307
Action Date Notes Link
article xml uploaded. 18 July 2023 14:53 CEST Original file -
article xml file uploaded 18 July 2023 14:53 CEST Update -
article pdf uploaded. 18 July 2023 14:53 CEST Version of Record https://www.mdpi.com/2076-3417/13/14/8307/pdf-vor
article supplementary file uploaded. 18 July 2023 14:53 CEST - https://www.mdpi.com/2076-3417/13/14/8307#supplementary
article html file updated 18 July 2023 14:54 CEST Original file -
article html file updated 18 July 2023 14:55 CEST Update -
article html file updated 18 July 2023 14:56 CEST Update -
article xml file uploaded 20 July 2023 07:46 CEST Update -
article xml uploaded. 20 July 2023 07:46 CEST Update -
article pdf uploaded. 20 July 2023 07:46 CEST Updated version of record https://www.mdpi.com/2076-3417/13/14/8307/pdf-vor
article html file updated 20 July 2023 07:47 CEST Update -
article html file updated 20 July 2023 07:55 CEST Update -
article html file updated 20 July 2023 07:56 CEST Update -
article xml file uploaded 25 July 2023 08:55 CEST Update -
article xml uploaded. 25 July 2023 08:55 CEST Update https://www.mdpi.com/2076-3417/13/14/8307/xml
article pdf uploaded. 25 July 2023 08:55 CEST Updated version of record https://www.mdpi.com/2076-3417/13/14/8307/pdf
article html file updated 25 July 2023 08:56 CEST Update -
article html file updated 6 August 2023 20:31 CEST Update https://www.mdpi.com/2076-3417/13/14/8307/html
Back to TopTop