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Journal: Appl. Sci., 2022
Volume: 12
Number: 2397

Article: The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes
Authors: by Adam Yuile, Alexander Schulz, Erik Wiss, Jens Müller and Steffen Wiese
Link: https://www.mdpi.com/2076-3417/12/5/2397

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