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Journal: Appl. Sci., 2022
Volume: 12
Number: 11478

Article: Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network
Authors: by Chien-Liang Liu, Chun-Jan Tseng, Wen-Hoar Hsaio, Sheng-Hao Wu and Shu-Rong Lu
Link: https://www.mdpi.com/2076-3417/12/22/11478

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