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Journal: Appl. Sci., 2022
Volume: 12
Number: 11478
Article:
Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network
Authors:
by
Chien-Liang Liu, Chun-Jan Tseng, Wen-Hoar Hsaio, Sheng-Hao Wu and Shu-Rong Lu
Link:
https://www.mdpi.com/2076-3417/12/22/11478
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