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        Journal: Appl. Sci., 2021
        Volume: 11 
                	Number: 4170 
                
        
        Article:
        Cell/Module Integration Technology with Wire-Embedded EVA Sheet 
        Authors: 
       	by
                    Jeong Eun Park, Won Seok Choi and Donggun Lim        
        Link:
        https://www.mdpi.com/2076-3417/11/9/4170
        
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