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Journal: Metals, 2019
Volume: 9
Number: 604

Article: Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints
Authors: by Xuewei Zhu, Jian Peng, Xiaofeng Wei, Pengpeng Yan and Fu Wang
Link: https://www.mdpi.com/2075-4701/9/5/604

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