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Metals 2018, 8(10), 772; https://doi.org/10.3390/met8100772

The Role of Glide during Creep of Copper at Low Temperatures

Materials Science and Engineering, KTH Royal Institute of Technology, SE-100 44 Stockholm, Sweden
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Received: 13 August 2018 / Revised: 13 September 2018 / Accepted: 18 September 2018 / Published: 27 September 2018
(This article belongs to the Special Issue Creep and High Temperature Deformation of Metals and Alloys)
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Abstract

Copper canister will be used in Scandinavia for final storage of spent nuclear fuel. The copper will be exposed to temperatures of up to 100 °C. The creep mechanism at near ambient temperatures has been assumed to be glide of dislocations, but this has never been verified for copper or other materials. In particular, no feasible mechanism for glide based static recovery has been proposed. To attack this classical problem, a glide mobility based on the assumption that it is controlled by the climb of the jogs on the dislocations is derived and shown that it is in agreement with observations. With dislocation dynamics (DD) simulations taking glide but not climb into account, it is demonstrated that creep based on glide alone can reach a quasi-stationary condition. This verifies that static recovery can occur just by glide. The DD simulations also show that the internal stress during creep in the loading direction is almost identical to the applied stress also directly after a load drop, which resolves further classical issues. View Full-Text
Keywords: creep; dislocation dynamics; glide; internal stress creep; dislocation dynamics; glide; internal stress
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Hosseinzadeh Delandar, A.; Sandström, R.; Korzhavyi, P. The Role of Glide during Creep of Copper at Low Temperatures. Metals 2018, 8, 772.

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