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Journal: Metals, 2016
Article: Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint
Authors: by Nashrah Hani Jamadon, Ai Wen Tan, Farazila Yusof, Tadashi Ariga, Yukio Miyashita and Mohd Hamdi
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