Jamadon, N.H.; Tan, A.W.; Yusof, F.; Ariga, T.; Miyashita, Y.; Hamdi, M.
Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint. Metals 2016, 6, 220.
https://doi.org/10.3390/met6090220
AMA Style
Jamadon NH, Tan AW, Yusof F, Ariga T, Miyashita Y, Hamdi M.
Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint. Metals. 2016; 6(9):220.
https://doi.org/10.3390/met6090220
Chicago/Turabian Style
Jamadon, Nashrah Hani, Ai Wen Tan, Farazila Yusof, Tadashi Ariga, Yukio Miyashita, and Mohd Hamdi.
2016. "Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint" Metals 6, no. 9: 220.
https://doi.org/10.3390/met6090220
APA Style
Jamadon, N. H., Tan, A. W., Yusof, F., Ariga, T., Miyashita, Y., & Hamdi, M.
(2016). Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint. Metals, 6(9), 220.
https://doi.org/10.3390/met6090220