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Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer
 
 

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Journal: Metals, 2016
Volume: 6
Number: 96

Article: Joining of TiAl to Steel by Diffusion Bonding with Ni/Ti Reactive Multilayers
Authors: by Sónia Simões, Ana S. Ramos, Filomena Viana, Maria Teresa Vieira and Manuel F. Vieira
Link: https://www.mdpi.com/2075-4701/6/5/96

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