Order Article Reprints
Journal: Metals, 2023
Volume: 13
Number: 12
Article:
Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates
Authors:
by
Andromeda Dwi Laksono, Tzu-Yang Tsai, Tai-Hsuan Chung, Yong-Chi Chang and Yee-Wen Yen
Link:
https://www.mdpi.com/2075-4701/13/1/12
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.