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Journal: Metals, 2023
Volume: 13
Number: 12

Article: Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates
Authors: by Andromeda Dwi Laksono, Tzu-Yang Tsai, Tai-Hsuan Chung, Yong-Chi Chang and Yee-Wen Yen
Link: https://www.mdpi.com/2075-4701/13/1/12

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