Shen, B.; Yang, S.; Xu, M.; Zhao, J.; Liu, G.; Xie, M.; Zhang, Q.
Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints. Metals 2022, 12, 1594.
https://doi.org/10.3390/met12101594
AMA Style
Shen B, Yang S, Xu M, Zhao J, Liu G, Xie M, Zhang Q.
Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints. Metals. 2022; 12(10):1594.
https://doi.org/10.3390/met12101594
Chicago/Turabian Style
Shen, Bingwei, Shangrong Yang, Mingyue Xu, Jincheng Zhao, Guohua Liu, Ming Xie, and Qiao Zhang.
2022. "Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints" Metals 12, no. 10: 1594.
https://doi.org/10.3390/met12101594
APA Style
Shen, B., Yang, S., Xu, M., Zhao, J., Liu, G., Xie, M., & Zhang, Q.
(2022). Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints. Metals, 12(10), 1594.
https://doi.org/10.3390/met12101594
