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Journal: Metals, 2021
Volume: 11
Number: 1155
1155
Article: Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
Authors: by Muhammad Iqbal Ahmad, Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Mohd Arif Anuar Mohd Salleh, Mohammad Hafifi Hafiz Ishak, Wan Rahiman and Marcin Nabiałek
Link: https://www.mdpi.com/2075-4701/11/8/1155

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