Wang, H.; Wei, J.; Lin, B.; Cui, X.; Hou, H.; Fu, Z.; Ding, J.; Sui, T.
Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide. Machines 2023, 11, 1057.
https://doi.org/10.3390/machines11121057
AMA Style
Wang H, Wei J, Lin B, Cui X, Hou H, Fu Z, Ding J, Sui T.
Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide. Machines. 2023; 11(12):1057.
https://doi.org/10.3390/machines11121057
Chicago/Turabian Style
Wang, Haoji, Jinhua Wei, Bin Lin, Xiaoqi Cui, Hetian Hou, Zhiyuan Fu, Jianchun Ding, and Tianyi Sui.
2023. "Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide" Machines 11, no. 12: 1057.
https://doi.org/10.3390/machines11121057
APA Style
Wang, H., Wei, J., Lin, B., Cui, X., Hou, H., Fu, Z., Ding, J., & Sui, T.
(2023). Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide. Machines, 11(12), 1057.
https://doi.org/10.3390/machines11121057