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Journal: Agronomy, 2023
Volume: 13
Number: 430
Article:
Genome-Wide Characterization of HSP90 Gene Family in Chinese Pumpkin (Cucurbita moschata Duch.) and Their Expression Patterns in Response to Heat and Cold Stresses
Authors:
by
Yanping Hu, Tingting Zhang, Peng Wang, Yuxin Li, Min Wang, Baibi Zhu, Daolong Liao, Tianhai Yun, Wenfeng Huang, Yisong Chen, Wen Zhang and Yang Zhou
Link:
https://www.mdpi.com/2073-4395/13/2/430
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