Hu, Y.; Zhang, T.; Wang, P.; Li, Y.; Wang, M.; Zhu, B.; Liao, D.; Yun, T.; Huang, W.; Chen, Y.;
et al. Genome-Wide Characterization of HSP90 Gene Family in Chinese Pumpkin (Cucurbita moschata Duch.) and Their Expression Patterns in Response to Heat and Cold Stresses. Agronomy 2023, 13, 430.
https://doi.org/10.3390/agronomy13020430
AMA Style
Hu Y, Zhang T, Wang P, Li Y, Wang M, Zhu B, Liao D, Yun T, Huang W, Chen Y,
et al. Genome-Wide Characterization of HSP90 Gene Family in Chinese Pumpkin (Cucurbita moschata Duch.) and Their Expression Patterns in Response to Heat and Cold Stresses. Agronomy. 2023; 13(2):430.
https://doi.org/10.3390/agronomy13020430
Chicago/Turabian Style
Hu, Yanping, Tingting Zhang, Peng Wang, Yuxin Li, Min Wang, Baibi Zhu, Daolong Liao, Tianhai Yun, Wenfeng Huang, Yisong Chen,
and et al. 2023. "Genome-Wide Characterization of HSP90 Gene Family in Chinese Pumpkin (Cucurbita moschata Duch.) and Their Expression Patterns in Response to Heat and Cold Stresses" Agronomy 13, no. 2: 430.
https://doi.org/10.3390/agronomy13020430
APA Style
Hu, Y., Zhang, T., Wang, P., Li, Y., Wang, M., Zhu, B., Liao, D., Yun, T., Huang, W., Chen, Y., Zhang, W., & Zhou, Y.
(2023). Genome-Wide Characterization of HSP90 Gene Family in Chinese Pumpkin (Cucurbita moschata Duch.) and Their Expression Patterns in Response to Heat and Cold Stresses. Agronomy, 13(2), 430.
https://doi.org/10.3390/agronomy13020430