Shape Memory Polymers Containing Higher Acrylate Content Display Increased Endothelial Cell Attachment
AbstractShape Memory Polymers (SMPs) are smart materials that can recall their shape upon the application of a stimulus, which makes them appealing materials for a variety of applications, especially in biomedical devices. Most prior SMP research has focused on tuning bulk properties; studying surface effects of SMPs may extend the use of these materials to blood-contacting applications, such as cardiovascular stents, where surfaces that support rapid endothelialization have been correlated to stent success. Here, we evaluate endothelial attachment onto the surfaces of a family of SMPs previously developed in our group that have shown promise for biomedical devices. Nine SMP formulations containing varying amounts of tert-Butyl acrylate (tBA) and Poly(ethylene glycol) dimethacrylate (PEGDMA) were analyzed for endothelial cell attachment. Dynamic mechanical analysis (DMA), contact angle studies, and atomic force microscopy (AFM) were used to verify bulk and surface properties of the SMPs. Human umbilical vein endothelial cell (HUVEC) attachment and viability was verified using fluorescent methods. Endothelial cells preferentially attached to SMPs with higher tBA content, which have rougher, more hydrophobic surfaces. HUVECs also displayed an increased metabolic activity on these high tBA SMPs over the course of the study. This class of SMPs may be promising candidates for next generation blood-contacting devices. View Full-Text
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Govindarajan, T.; Shandas, R. Shape Memory Polymers Containing Higher Acrylate Content Display Increased Endothelial Cell Attachment. Polymers 2017, 9, 572.
Govindarajan T, Shandas R. Shape Memory Polymers Containing Higher Acrylate Content Display Increased Endothelial Cell Attachment. Polymers. 2017; 9(11):572.Chicago/Turabian Style
Govindarajan, Tina; Shandas, Robin. 2017. "Shape Memory Polymers Containing Higher Acrylate Content Display Increased Endothelial Cell Attachment." Polymers 9, no. 11: 572.
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