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Journal: Polymers, 2015
Volume: 7
Number: 985

Article: Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates
Authors: by Cheolgyu Kim, Tae-Ik Lee, Min Sung Kim and Taek-Soo Kim
Link: https://www.mdpi.com/2073-4360/7/6/985

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