Sun, Y.; Wang, H.; Jiang, J.; Wang, K.; Bai, W.; Chu, D.; Jian, R.; Hou, P.; He, Y.; Deng, W.
Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions. Polymers 2026, 18, 1122.
https://doi.org/10.3390/polym18091122
AMA Style
Sun Y, Wang H, Jiang J, Wang K, Bai W, Chu D, Jian R, Hou P, He Y, Deng W.
Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions. Polymers. 2026; 18(9):1122.
https://doi.org/10.3390/polym18091122
Chicago/Turabian Style
Sun, Yancai, Haoran Wang, Jingtao Jiang, Kongshuo Wang, Wenjuan Bai, Dianming Chu, Ranran Jian, Peiwu Hou, Yan He, and Wenzhong Deng.
2026. "Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions" Polymers 18, no. 9: 1122.
https://doi.org/10.3390/polym18091122
APA Style
Sun, Y., Wang, H., Jiang, J., Wang, K., Bai, W., Chu, D., Jian, R., Hou, P., He, Y., & Deng, W.
(2026). Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions. Polymers, 18(9), 1122.
https://doi.org/10.3390/polym18091122