Li, Z.; Han, Z.; Zhang, X.; Xu, Y.; Zou, L.; Huang, K.; Ren, H.
Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials. Polymers 2026, 18, 1232.
https://doi.org/10.3390/polym18101232
AMA Style
Li Z, Han Z, Zhang X, Xu Y, Zou L, Huang K, Ren H.
Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials. Polymers. 2026; 18(10):1232.
https://doi.org/10.3390/polym18101232
Chicago/Turabian Style
Li, Zhen, Zhiyun Han, Xinkai Zhang, Yizhou Xu, Liang Zou, Kejie Huang, and Hanwen Ren.
2026. "Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials" Polymers 18, no. 10: 1232.
https://doi.org/10.3390/polym18101232
APA Style
Li, Z., Han, Z., Zhang, X., Xu, Y., Zou, L., Huang, K., & Ren, H.
(2026). Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials. Polymers, 18(10), 1232.
https://doi.org/10.3390/polym18101232
