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Journal: Polymers, 2024
Volume: 16
Number: 463
463
Article: Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components
Authors: by Pedro Morais, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy and Lucas F. M. da Silva
Link: https://www.mdpi.com/2073-4360/16/4/463

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