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Polymers2024, 16(4), 463;https://doi.org/10.3390/polym16040463

Journal: PolymersVolume: 16Number: 463

Article: Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components

Authors:
Pedro Morais¹,
Alireza Akhavan-Safar^2,* and
Ricardo J. C. Carbas^2,*
et al.

Link: https://www.mdpi.com/2073-4360/16/4/463

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