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Journal: Polymers, 2024
Volume: 16
Number: 2597

Article: Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint
Authors: by Peng Zhang, Songbai Xue, Lu Liu, Jianhao Wang, Hiroaki Tatsumi and Hiroshi Nishikawa
Link: https://www.mdpi.com/2073-4360/16/18/2597

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