Tan, X.J.; Cheng, E.M.; Mohd Nasir, N.F.; Abdul Majid, M.S.; Mohd Jamir, M.R.; Khor, S.F.; Lee, K.Y.; You, K.Y.; Mohamad, C.W.S.R.
Lumped-Element Circuit Modeling for Composite Scaffold with Nano-Hydroxyapatite and Wangi Rice Starch. Polymers 2023, 15, 354.
https://doi.org/10.3390/polym15020354
AMA Style
Tan XJ, Cheng EM, Mohd Nasir NF, Abdul Majid MS, Mohd Jamir MR, Khor SF, Lee KY, You KY, Mohamad CWSR.
Lumped-Element Circuit Modeling for Composite Scaffold with Nano-Hydroxyapatite and Wangi Rice Starch. Polymers. 2023; 15(2):354.
https://doi.org/10.3390/polym15020354
Chicago/Turabian Style
Tan, Xiao Jian, Ee Meng Cheng, Nashrul Fazli Mohd Nasir, Mohd Shukry Abdul Majid, Mohd Ridzuan Mohd Jamir, Shing Fhan Khor, Kim Yee Lee, Kok Yeow You, and Che Wan Sharifah Robiah Mohamad.
2023. "Lumped-Element Circuit Modeling for Composite Scaffold with Nano-Hydroxyapatite and Wangi Rice Starch" Polymers 15, no. 2: 354.
https://doi.org/10.3390/polym15020354
APA Style
Tan, X. J., Cheng, E. M., Mohd Nasir, N. F., Abdul Majid, M. S., Mohd Jamir, M. R., Khor, S. F., Lee, K. Y., You, K. Y., & Mohamad, C. W. S. R.
(2023). Lumped-Element Circuit Modeling for Composite Scaffold with Nano-Hydroxyapatite and Wangi Rice Starch. Polymers, 15(2), 354.
https://doi.org/10.3390/polym15020354
